DocumentCode
3203879
Title
Hybrid-integrated silicon photonic circuit with an InGaAs photodetetor
Author
Xu, Haihua ; Hu, Yingtao ; Zhu, Yu ; Li, Yuntao ; Li, Zhiyong ; Fan, Zhongchao ; Yu, Yude ; Yu, Jinzhong
Author_Institution
State Key Lab. on Integrated Optoelectron., Chinese Acad. of Sci., Beijing, China
fYear
2010
fDate
1-3 Sept. 2010
Firstpage
126
Lastpage
128
Abstract
Flip-chip bonding and grating-assisted coupling techniques are proposed to integrate silicon photonic circuit with an InGaAs photodetector. Coupler-to-photodetector coupling efficiency of ~4 dB and data transmission of 1 Gbps are demonstrated.
Keywords
III-V semiconductors; diffraction gratings; flip-chip devices; gallium arsenide; indium compounds; integrated optics; optical communication equipment; optical couplers; photodetectors; InGaAs; bit rate 1 Gbit/s; coupler-to-photodetector coupling; flip chip bonding; grating assisted coupling techniques; hybrid integrated silicon photonic circuit; photodetector; Couplers; Couplings; Gratings; Optical waveguides; Photodetectors; Photonics; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Group IV Photonics (GFP), 2010 7th IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-6344-2
Type
conf
DOI
10.1109/GROUP4.2010.5643404
Filename
5643404
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