Title :
Advanced embedded active assemblies for extreme space applications
Author :
Del Castillo, Linda ; Moussessian, Alina ; Mojarradi, Mohammad ; Kolawa, Elizabeth ; Johnson, R. Wayne ; Blalock, Benjamin J.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
Abstract :
This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications.
Keywords :
avionics; flip-chip devices; lead bonding; liquid crystal polymers; tape automated bonding; Mars surface conditions; advanced embedded active assemblies; electronic die integration; embedded opamp assembly; extreme space applications; flexible liquid crystal polymer; flexible membrane structures; gold thermocompression flip chip bonding; membrane polymers; motor control electronics; operational amplifier; Assembly; Biomembranes; Flexible printed circuits; Gold; Joining processes; Liquid crystal polymers; Mars; Operational amplifiers; Silicon; Space technology;
Conference_Titel :
Aerospace conference, 2009 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
978-1-4244-2621-8
Electronic_ISBN :
978-1-4244-2622-5
DOI :
10.1109/AERO.2009.4839527
