DocumentCode :
3206771
Title :
An improved system approach towards future cochlear implants
Author :
Lawand, N.S. ; Ngamkham, W. ; Nazarian, G. ; French, P.J. ; Serdijn, Wouter A. ; Gaydadjiev, Georgi N. ; Briaire, J.J. ; Frijns, J.H.M.
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
5163
Lastpage :
5166
Abstract :
Cochlear implants (CIs) have been used for many years to restore hearing for deaf patients. Unfortunately, today´s CIs are still bulky devices and uncomfortable to wear. In this paper we present three innovations that ultimately should pave the way to a fully implantable bionic ear. First a microfabrication process used to fabricate the polymer metal microelectrode array for auditory nerve stimulation is discussed. Subsequently, a compact biphasic programmable stimulator chip to be used along with this electrode array is presented. By using a double loop feedback circuit topology, the circuit provides a precise stimulation current while requiring only little voltage headroom. The resulting low power consumption and reduced chip area allow for integration of the electronic circuitry onto the electrode array. Finally, as reliability and data transmission rate are two of the most critical issues in CI devices, we propose a software method to improve both data rate and reliability of transmitting digital data from the external part of the CI to the internal part with negligible power consumption.
Keywords :
bioMEMS; circuit feedback; cochlear implants; ear; handicapped aids; hearing; low-power electronics; microelectrodes; microfabrication; network topology; programmable circuits; auditory nerve stimulation; chip area reduction; cochlear implant; compact biphasic programmable stimulator chip; data transmission rate; deaf patient; double loop feedback circuit topology; electronic circuitry integration; hearing restoration; implantable bionic ear; low power consumption; microfabrication process; polymer metal microelectrode array; stimulation current; voltage headroom; Arrays; Microelectrodes; Software; Software reliability; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610711
Filename :
6610711
Link To Document :
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