Title :
The integration of surface micromachined devices with optoelectronics: technology and applications
Author :
Warren, M.E. ; Blum, O. ; Sullivan, C.T. ; Shul, R.J. ; Rodgers, M.S. ; Sniegowski, J.J.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Abstract :
We describe efforts in integrating MEMS and optoelectronic or photonic functions and the fabrication constraints on both system components. The MEMS technology used in this work are silicon surface-machined systems fabricated using the SUMMiT (Sandia ultraplanar multilevel MEMS technology) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.
Keywords :
chemical mechanical polishing; integrated optoelectronics; micro-optics; micromachining; micromechanical devices; optical fabrication; silicon; MEMS; MEMS technology; SUMMiT; Sandia ultraplanar multilevel MEMS technology; Sandia ultraplanar multilevel MEMS technology process; Si; chemical-mechanical polishing; fabrication constraints; intermediate planarization step; optoelectronics; photonic functions; polysilicon; silicon surface-machined systems; surface micromachined devices; system components; Chemical technology; Dielectric substrates; Micromechanical devices; Optical beams; Optical devices; Optical surface waves; Optoelectronic and photonic sensors; Packaging; Silicon; Vertical cavity surface emitting lasers;
Conference_Titel :
Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-4953-9
DOI :
10.1109/LEOSST.1998.689703
