• DocumentCode
    3210494
  • Title

    Improved layer assignment for packaging multichip modules

  • Author

    Chen, Cheng-Hsi ; Heydari, Mohammad H. ; Tollis, Ioannis G. ; Xia, Chunliang

  • Author_Institution
    Dept. of Comput. Sci., Texas Univ., Dallas, Richardson, TX, USA
  • fYear
    1992
  • fDate
    4-6 Nov 1992
  • Firstpage
    315
  • Lastpage
    324
  • Abstract
    The layer assignment problem plays an important role in packaging multichip modules, since the number of layers is directly related to the cost of the final product. In this paper, the authors propose a new model for the problem and a heuristic layer assignment algorithm based on the new model. The experimental results presented show that the solution provided by the algorithm is close to the lower bound
  • Keywords
    multichip modules; network routing; packaging; cost; heuristic layer assignment algorithm; layer assignment; lower bound; packaging multichip modules; Computer science; Costs; Electronics industry; Heuristic algorithms; Lead compounds; Multichip modules; Packaging machines; Semiconductor device manufacture; Semiconductor device packaging; Upper bound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 1992. Proceedings., 1992 IEEE International Workshop on
  • Conference_Location
    Dallas, TX
  • ISSN
    1550-5774
  • Print_ISBN
    0-8186-2837-5
  • Type

    conf

  • DOI
    10.1109/DFTVS.1992.224343
  • Filename
    224343
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3210494