• DocumentCode
    3211259
  • Title

    Investigation of reliability problems in thermal inkjet printhead

  • Author

    Lim, Ji-hyuk ; Keon-Kuk ; Shin, Seung-loo ; Baek, Seog-Soon ; Kim, Young-lae ; Shin, Long-Woo ; Oh, Yong-Soo

  • Author_Institution
    MEMS Lab., Samsung Adv. Inst. of Technol., Gyeonggi-Do, South Korea
  • fYear
    2004
  • fDate
    25-29 April 2004
  • Firstpage
    251
  • Lastpage
    254
  • Abstract
    This paper presents a failure analysis result for enhancing the reliability of thermal inkjet printhead. A novel inkjet printhead is fabricated using MEMS process, and we analyze the failure mechanism of inkjet head based on detailed experimental observations. The design modification of micro heater to avoid an early stage of failure yields the reliability enhancement of printhead.
  • Keywords
    electromigration; failure analysis; ink jet printers; micromechanical devices; semiconductor device reliability; MEMS process; design modification; micro heater; reliability problems; thermal inkjet printhead; Current; Failure analysis; Ink; Micromechanical devices; Nickel; Optical microscopy; Scanning electron microscopy; Shape; Surface cracks; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
  • Print_ISBN
    0-7803-8315-X
  • Type

    conf

  • DOI
    10.1109/RELPHY.2004.1315332
  • Filename
    1315332