DocumentCode
3211260
Title
Non Contacting Measurement of Surface Resistivity Using Phi Type Electrodes
Author
Sugimoto, Toshiyuki ; Ishii, Hiromu ; Higashiyama, Yoshio
Author_Institution
Dept. Electr. Eng., Yamagata Univ., Yonezawa
fYear
2008
fDate
5-9 Oct. 2008
Firstpage
1
Lastpage
6
Abstract
Non contacting measurement of surface resistivity has been investigated by simultaneous applications of corona charging to a test sample and measuring surface potential around the charged spot. The corona charging electrodes are consisted of a grounded plane electrode with a circular hole and a needle electrode penetrating the plane electrode at the center of the hole, defined as phi type electrodes. The test sample to be measured is placed underneath of the phi type electrode and is charged partially around the needle electrode where the corona ions emitted from. An electrostatic field meter is located on the grounded plane electrode to measure the surface potential around the needle electrode. Because the surface potential distribution around the charged area is determined by its surface resistivity, the electrostatic properties of the sample, i.e. dissipative or insulative, can be detected without any contact electrode onto the sample. The experimental setup, measured and predicted surface potentials are presented. Distribution of surface potential at the test surface partly covered with antistatic spray is also presented for a possible application of non contacting measurement of the surface resistivity.
Keywords
charge measurement; electric fields; electric resistance measurement; surface potential; antistatic spray; corona charging electrode; electrostatic field meter; electrostatic property; grounded plane electrode; needle electrode; phi type electrodes; surface potential; surface resistivity non contact measurement; Conductivity; Corona; Current measurement; Electrodes; Electrostatic measurements; Insulation; Needles; Spraying; Surface charging; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE
Conference_Location
Edmonton, Alta.
ISSN
0197-2618
Print_ISBN
978-1-4244-2278-4
Electronic_ISBN
0197-2618
Type
conf
DOI
10.1109/08IAS.2008.110
Filename
4658898
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