DocumentCode :
3212155
Title :
Investigation of misfit dislocation leakage in supercritical strained silicon MOSFETs
Author :
Fiorenza, J.G. ; Braithwaite, G. ; Leitz, C. ; Currie, M.T. ; Cheng, Z.Y. ; Yang, V.K. ; Langdo, T. ; Carlin, Jean-Francois ; Somerville, M. ; Lochtefeld, A. ; Badawi, H. ; Bulsara, M.T.
Author_Institution :
AmberWave Syst. Corp., Salem, NH, USA
fYear :
2004
fDate :
25-29 April 2004
Firstpage :
493
Lastpage :
497
Abstract :
This paper investigates off-state current leakage in strained silicon NMOSFETs built on supercritical thickness strained silicon films. it describes a simple conceptual model for the off-state leakage: the leakage is caused by enhanced dopant diffusion near misfit dislocations. This paper studies the validity of this hypothesis using both DC IV measurements and photon emission microscopy measurements of NMOSFETs with several different supercritical strained silicon thickness values. It shows that the emission measurements of the off-state leakage and the gate length dependence of the off-state leakage can both be easily explained by the leakage model. It also demonstrates that the response to an applied gate or back-bias voltage of the IV characteristics and the light emission data can be understood within the context of the proposed conceptual model.
Keywords :
MOSFET; dislocation structure; elemental semiconductors; leakage currents; semiconductor device breakdown; semiconductor device reliability; silicon; conceptual model; dopant diffusion; gate length dependence; misfit dislocation leakage; off-state current leakage; off-state leakage; photon emission microscopy; supercritical strained Si MOSFETs; supercritical thickness; Degradation; Educational institutions; Fabrication; Germanium silicon alloys; MOSFETs; Microscopy; Semiconductor films; Semiconductor process modeling; Silicon germanium; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN :
0-7803-8315-X
Type :
conf
DOI :
10.1109/RELPHY.2004.1315378
Filename :
1315378
Link To Document :
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