Title :
Optoelectronic multichip modules using MEMS fabrication techniques
Author :
Koh, S. ; Wu, D. ; Lantz, M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Dayton Univ., OH, USA
Abstract :
The paper addresses design, fabrication, and packaging issues of optoelectronic multichip modules (OE-MCM), which combine guided wave optoelectronic interconnects, MCM packaging, and microelectro-mechanical systems (MEMS) fabrication techniques.
Keywords :
integrated optoelectronics; micro-optics; micromechanical devices; multichip modules; optical communication equipment; optical design techniques; optical fabrication; optical interconnections; packaging; MCM packaging; MEMS fabrication techniques; guided wave optoelectronic interconnects; microelectro-mechanical systems; optical design; optical fabrication; optoelectronic multichip modules; packaging issues; Clocks; Micromechanical devices; Microprocessors; Mirrors; Multichip modules; Optical arrays; Optical device fabrication; Optical interconnections; Optical waveguides; Silicon;
Conference_Titel :
Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-4953-9
DOI :
10.1109/LEOSST.1998.689729
