Title :
Construction of a chondrocyte cell sheet using temperature-responsive poly(N-isopropylacrylamide)-co-acrylamide
Author :
Viravaidya-Pasuwat, Kwanchanok ; Wong-in, Sopita ; Sakulaue, Phongphot ; Siriwatwechakul, Wanwipa
Author_Institution :
Chem. Eng. Dept., King Mongkut´s Univ. of Technol., Bangkok, Thailand
Abstract :
In this study, a novel temperature-responsive poly(N-isopropylacrylamide)-co-acrylamide was used to prepare a chondrocyte cell sheet. Chondrocytes were isolated from human articular cartilage and plated on the copolymer film grafted tissue culture plates. The cell attachment on the copolymer film was shown to be similar to that of the ungrafted surface. To harvest a cell sheet, the incubation temperature was reduced to 10°C for 30 minutes to allow the polymer chain to fully extend, changing the copolymer´s phase from hydrophobicity to hydrophilicity. Additional incubation at 20°C for 60 minutes was necessary to activate the cellular metabolism required for cytoskeletal organization and cell detachment. A complete cell sheet recovery was achieved when a PVDF membrane was used as a cell sheet carrier. Unfortunately, the shrinkage of the cell sheet was observed. Nonetheless, the harvested cell sheet was shown to be viable and healthy.
Keywords :
biomedical materials; cellular biophysics; hydrophilicity; hydrophobicity; polymer blends; polymer films; tissue engineering; PVDF membrane; cell attachment; cell detachment; cell sheet carrier; cell sheet shrinkage; cellular metabolism; chondrocyte cell sheet; copolymer film grafted tissue culture plates; cytoskeletal organization; human articular cartilage; hydrophilicity; hydrophobicity; incubation temperature; polymer chain; temperature 20 degC; temperature-responsive poly(N-isopropylacrylamide)-co-acrylamide; time 30 min; time 60 min; Biomembranes; Extracellular; Films; Polymers; Surface morphology; Surface treatment; Temperature;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6611161