Title :
Testability and signal integrity in a low cost multichip module
Author :
Omer, Ahmed ; Flint, Andrew
Author_Institution :
Semicond. Products, Motorola Inc., Austin, TX, USA
Abstract :
The design process for low-cost multichip modules is presented. Modifications to the design are often made in order to increase testability. Some of these modifications can degrade signal integrity, however. The important aspects to consider in order to make rational design tradeoffs are presented
Keywords :
design for testability; integrated circuit design; integrated circuit testing; multichip modules; DFT; design process; low cost MCM; multichip module; signal integrity; testability; Circuit noise; Costs; Crosstalk; Integrated circuit packaging; Multichip modules; Pins; Process design; Signal design; Testing; Thermal management;
Conference_Titel :
Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3639-9
DOI :
10.1109/ICISS.1996.552426
