DocumentCode
3218407
Title
Testability and signal integrity in a low cost multichip module
Author
Omer, Ahmed ; Flint, Andrew
Author_Institution
Semicond. Products, Motorola Inc., Austin, TX, USA
fYear
1996
fDate
9-11 Oct 1996
Firstpage
189
Lastpage
197
Abstract
The design process for low-cost multichip modules is presented. Modifications to the design are often made in order to increase testability. Some of these modifications can degrade signal integrity, however. The important aspects to consider in order to make rational design tradeoffs are presented
Keywords
design for testability; integrated circuit design; integrated circuit testing; multichip modules; DFT; design process; low cost MCM; multichip module; signal integrity; testability; Circuit noise; Costs; Crosstalk; Integrated circuit packaging; Multichip modules; Pins; Process design; Signal design; Testing; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on
Conference_Location
Austin, TX
ISSN
1063-2204
Print_ISBN
0-7803-3639-9
Type
conf
DOI
10.1109/ICISS.1996.552426
Filename
552426
Link To Document