Multichip module yield enhancement using passive substrate fault tolerance

Author

Peacock, Chris ; Bolouri, Hamid ; Habiger, Claus

Author_Institution

Eng. Res. & Dev. Centre, Hertfordshire Univ., Hatfield, UK

fYear

1996

fDate

9-11 Oct 1996

Firstpage

198

Lastpage

209

Abstract

The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture

Keywords

circuit optimisation; failure analysis; fault tolerant computing; integrated circuit reliability; integrated circuit yield; multichip modules; random-access storage; redundancy; KGD problem; MCM yield enhancement; RAM dies; known good die problem; multichip module technology; paged address space; passive substrate fault tolerance; processor-memory MCM architecture; spare memory dies; Circuit faults; Circuit testing; Costs; Fault tolerance; Manufacturing; Multichip modules; Packaging; Printed circuits; Read-write memory; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on

Conference_Location

Austin, TX

ISSN

1063-2204

Print_ISBN

0-7803-3639-9

Type

conf

DOI

10.1109/ICISS.1996.552427

Filename

552427