Title :
Multichip module yield enhancement using passive substrate fault tolerance
Author :
Peacock, Chris ; Bolouri, Hamid ; Habiger, Claus
Author_Institution :
Eng. Res. & Dev. Centre, Hertfordshire Univ., Hatfield, UK
Abstract :
The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture
Keywords :
circuit optimisation; failure analysis; fault tolerant computing; integrated circuit reliability; integrated circuit yield; multichip modules; random-access storage; redundancy; KGD problem; MCM yield enhancement; RAM dies; known good die problem; multichip module technology; paged address space; passive substrate fault tolerance; processor-memory MCM architecture; spare memory dies; Circuit faults; Circuit testing; Costs; Fault tolerance; Manufacturing; Multichip modules; Packaging; Printed circuits; Read-write memory; Space technology;
Conference_Titel :
Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3639-9
DOI :
10.1109/ICISS.1996.552427
