• DocumentCode
    3219969
  • Title

    Electrodeposition of polyurethane adhesive for MEMS application

  • Author

    Wang, Yuli ; Bachman, Mark ; Li, Guann-Pyng

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Irvine, CA, USA
  • fYear
    2005
  • fDate
    16-18 March 2005
  • Firstpage
    82
  • Lastpage
    84
  • Abstract
    This paper presents a polymer electrodeposition process to prepare micro-size adhesive on electrically conductive substrates, and demonstrates its application for microelectromechanical systems (MEMS). UV-curable polyurethane latex was first formulated for cathodic electrodeposition process. Polyurethane was then conformally coated onto the conductive substrates by electrodeposition of polyurethane aqueous latex at 25 V for 1 minute. The coated polyurethane films is adherent, as a result it can be used as adhesive to bond other microstructures. The polyurethane adhesive can be further solidified by UV radiation for 2 minutes. Photolithography was used to pattern the conductive substrates with photoresist layer, which help to localize the polymer electrodeposition at specific surface locations. The deposited adhesive volume is able to be controlled in the magnitude of 10 femtoliters by adjusting the pattern size and the electrodeposition time. The electrodeposited polyurethane adhesive is useful for MEMS bonding.
  • Keywords
    adhesive bonding; adhesives; electrodeposition; micromechanical devices; photolithography; polymers; 1 min; 25 V; MEMS application; UV-curable polyurethane latex; cathodic electrodeposition; electrically conductive substrates; microelectromechanical systems; microsize adhesive; photolithography; photoresist layer; polymer electrodeposition; polyurethane adhesive; polyurethane aqueous latex; Application software; Bonding; Coatings; Microelectromechanical systems; Micromechanical devices; Microstructure; Polymer films; Resists; Solvents; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
  • ISSN
    1550-5723
  • Print_ISBN
    0-7803-9085-7
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2005.1432052
  • Filename
    1432052