Title :
Molecular vapor deposition (MVD™) - a new method of applying moisture barriers for packaging applications
Author :
Wanebo, Mike ; Kobrin, Boris ; Helmrich, Fred ; Chinn, Jeff
Author_Institution :
Appl. MicroStructures, Inc., San Jose, CA, USA
Abstract :
We propose that a composite hydrophobic SAM film with 100% coverage of all exposed surfaces can be used in many advance packaging applications. For example, a SAM moisture barrier with conventional plastic packaging could be a low cost alternative to hermetic ceramic housed devices and SAMs could be barriers to prevent moisture induced corrosion.
Keywords :
corrosion protective coatings; electronics packaging; monolayers; plastic packaging; self-assembly; vapour deposited coatings; SAM moisture barrier; composite hydrophobic SAM film; electronics packaging; hermetic ceramic housed devices; moisture induced corrosion; molecular vapor deposition; plastic packaging; self-assembled monolayer; Chemical vapor deposition; Coatings; Composite materials; Inorganic materials; Moisture; Packaging; Plasma temperature; Polymer films; Stability; Substrates;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432063
