• DocumentCode
    3220633
  • Title

    Characterization of mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive

  • Author

    Kristiansen, Helge ; Zhang, Z.L. ; Liu, J.

  • Author_Institution
    Conpart A.S., Kjeller, Norway
  • fYear
    2005
  • fDate
    16-18 March 2005
  • Firstpage
    209
  • Lastpage
    213
  • Abstract
    Metal coated small (micron sized) polymer particles are used in developing anisotropic conductive adhesives (ACA). The mechanical properties of polymer particles are of crucial importance both to assembly process and the reliability of ACA. Tn this paper we present a method to determine the mechanical properties of polymer sphere particles by using inverse indentation test - soft elastic sphere against rigid flat. Finite element analyses have been carried out to study the large deformation contact between the sphere particle and a rigid flat. The classical Hertz solution works only for small sphere deformation. A modification has been made to the Hertz contact force-displacement solution and an approximate equation is presented. A capacitance based experimental setup for particle indentation has been built. The proposed method has been applied to determine the elastic properties of typical polymer particles used for conductive adhesives. For the metal plated polymer particles tested, it has been found that a linear elastic model seems to hold for a large range of deformation.
  • Keywords
    adhesives; coatings; conducting polymers; deformation; elasticity; failure analysis; finite element analysis; flip-chip devices; microassembling; particle reinforced composites; ACA; Hertz contact force-displacement solution; Hertz solution; anisotropic conductive adhesive; approximate equation; assembly process; capacitance based experimental setup; deformation contact; elastic properties; finite element analysis; inverse indentation test; linear elastic model; mechanical properties; metal-coated polymer sphere; micron sized polymer particle; reliability; rigid flat; soft elastic sphere; Anisotropic magnetoresistance; Assembly; Capacitance; Conductive adhesives; Deformable models; Equations; Finite element methods; Mechanical factors; Polymer films; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
  • ISSN
    1550-5723
  • Print_ISBN
    0-7803-9085-7
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2005.1432077
  • Filename
    1432077