DocumentCode :
3221956
Title :
Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes For High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates
Author :
Paik, Kyung Wook ; Hyun, Jin Gul ; Lee, Sangyong ; Jang, Kyung Woon
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
794
Lastpage :
801
Abstract :
Epoxy/BaTiO3 composite embedded capacitor films (ECFs) were newly designed for high dielectric constant and low tolerance (less than plusmn5%) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent, and in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. Dielectric properties of BaTiO3 (BT) & SrTiO3 (ST) composite ECF is measured MIM capacitors with oxygen plasma etched ECFs on 10times10 cm PCBs. For 1times1 mm capacitors with 12 um thickness and 50 vol.%BTO ECFs, dielectric constant of 39, dielectric loss of 0.017, capacitance density of 2.4 nF/cm2, and less than 10% tolerance were obtained. Dielectric constant of BTOECF is bigger than that of STECF, and it is due to difference of permittivity of BT and SrTiO3 particles. Dielectric constant of BT & ST ECF in high frequency range (0.5~10 GHz) is measured using a cavity resonance method. In order to estimate dielectric constants at high frequency, the reflection coefficient is measured with a network analyzer. Dielectric constant is calculated by observing the frequencies of the resonant cavity modes. Although there was no dielectric relaxation observed at pure epoxy, for BT ECF, there is the dielectric relaxation at 5~9GHz. It is mainly due to changing of polarization mode of BT powder itself. In contrast, there is no relaxation for ST ECF up to 10 GHz. Alternative material for embedded capacitor fabrication is epoxy/BT composite embedded capacitor pastes (ECPs). It uses similar materials formulation like ECFs and a screen printing method for film coating. The screen printing method has the advantage of forming capacitor partially in desired area. But the screen printing makes surface irregularity during mask peel-off. Surface flatness is significantly improved by adding some additives and by applyi- ng pressure during curing. As a result, dielectric layer with improved thickness uniformity is successfully demonstrated. For 4times4 mm capacitors with 11 um thickness and 50 vol.% BT ECFs, dielectric constant of 39, dielectric loss of 0.023, capacitance density of2.6nF/cm2, and 22% tolerance were obtained
Keywords :
MIM devices; barium compounds; capacitors; composite materials; dielectric losses; dielectric relaxation; high-k dielectric thin films; permittivity; polymer films; powders; strontium compounds; titanium compounds; 0.5 to 10 GHz; 1 mm; 11 micron; 12 micron; 4 mm; 5 to 9 GHz; BaTiO3; MIM capacitors; SrTiO3; additives; cavity resonance method; coating process; comma roll coating method; composite films; dielectric constant; dielectric loss; dielectric properties; dielectric relaxation; embedded capacitor films; epoxy resin; film coating; latent curing agent; network analyzer; organic substrates; pastes; plasma etching; screen printing method; surface flatness; Capacitors; Coatings; Dielectric constant; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectric substrates; Fabrication; High-K gate dielectrics; Printing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280102
Filename :
4060827
Link To Document :
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