• DocumentCode
    3222006
  • Title

    Investigating the NBTI effect on P- and N-substrate MOS capacitors and p-MOSFET transistors

  • Author

    Benabdelmoumene, Abdelmadjid ; Djezzar, Boualem ; Tahi, Hakim ; Chenouf, Amel ; Mohamed, Goudjil ; Kechouane, Mohamed

  • Author_Institution
    Microelectron. & Nanotechnol. Div., Centre de Dev. des Technol. Av., Baba Hassen, Algeria
  • fYear
    2013
  • fDate
    15-18 Dec. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Using measure/stress/measure (MSM) protocol, Negative bias temperature instability (NBTI) has been investigated on P-and N-substrate MOS capacitors through flat band shift evolution. The same protocol on p-MOSFET´s transistors, with different channel lengths, has been also examined through threshold voltage shift evolution. The results have shown that P-substrate MOS capacitors are more affected than N-substrate MOS capacitors. We have suggested that the amphoteric nature of interface traps and the positive nature of the oxide traps could explain this result. In addition, the exponent n is higher in N-substrate than in P-substrate capacitors. Higher the degradation is, lower n is. On the other hand, we have shown that P-doped lightly doped drain (LDD) and source/drain regions of p-MOSFET transistors are more affected than the middle of the channel under NBTI stress conditions. These results point out the influence of the Boron doping on the NBTI degradation. Also, this behavior suggests that the generation mechanism in the edge region is different from that in the channel region.
  • Keywords
    MOS capacitors; MOSFET; interface states; negative bias temperature instability; semiconductor device reliability; semiconductor doping; N-substrate MOS capacitor; NBTI; NBTI degradation; NBTI effect; NBTI stress condition; P-doped LDD; P-doped lightly-doped drain; P-substrate MOS capacitor; P-substrate MOS capacitors; P-substrate capacitors; boron doping; channel length; channel region; edge region; flat band shift evolution; generation mechanism; interface trap amphoteric nature; measure-stress-measure protocol; negative bias temperature instability; oxide traps; p-MOSFET transistors; source-drain regions; threshold voltage shift evolution; Capacitors; Doping; MOS capacitors; MOSFET circuits; Reliability; Stress; Voltage measurement; NBTI; P-and N-substrate MOS capacitors; hole trapping; interface-trap; oxide-trap;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (ICM), 2013 25th International Conference on
  • Conference_Location
    Beirut
  • Print_ISBN
    978-1-4799-3569-7
  • Type

    conf

  • DOI
    10.1109/ICM.2013.6734981
  • Filename
    6734981