DocumentCode
3222006
Title
Investigating the NBTI effect on P- and N-substrate MOS capacitors and p-MOSFET transistors
Author
Benabdelmoumene, Abdelmadjid ; Djezzar, Boualem ; Tahi, Hakim ; Chenouf, Amel ; Mohamed, Goudjil ; Kechouane, Mohamed
Author_Institution
Microelectron. & Nanotechnol. Div., Centre de Dev. des Technol. Av., Baba Hassen, Algeria
fYear
2013
fDate
15-18 Dec. 2013
Firstpage
1
Lastpage
4
Abstract
Using measure/stress/measure (MSM) protocol, Negative bias temperature instability (NBTI) has been investigated on P-and N-substrate MOS capacitors through flat band shift evolution. The same protocol on p-MOSFET´s transistors, with different channel lengths, has been also examined through threshold voltage shift evolution. The results have shown that P-substrate MOS capacitors are more affected than N-substrate MOS capacitors. We have suggested that the amphoteric nature of interface traps and the positive nature of the oxide traps could explain this result. In addition, the exponent n is higher in N-substrate than in P-substrate capacitors. Higher the degradation is, lower n is. On the other hand, we have shown that P-doped lightly doped drain (LDD) and source/drain regions of p-MOSFET transistors are more affected than the middle of the channel under NBTI stress conditions. These results point out the influence of the Boron doping on the NBTI degradation. Also, this behavior suggests that the generation mechanism in the edge region is different from that in the channel region.
Keywords
MOS capacitors; MOSFET; interface states; negative bias temperature instability; semiconductor device reliability; semiconductor doping; N-substrate MOS capacitor; NBTI; NBTI degradation; NBTI effect; NBTI stress condition; P-doped LDD; P-doped lightly-doped drain; P-substrate MOS capacitor; P-substrate MOS capacitors; P-substrate capacitors; boron doping; channel length; channel region; edge region; flat band shift evolution; generation mechanism; interface trap amphoteric nature; measure-stress-measure protocol; negative bias temperature instability; oxide traps; p-MOSFET transistors; source-drain regions; threshold voltage shift evolution; Capacitors; Doping; MOS capacitors; MOSFET circuits; Reliability; Stress; Voltage measurement; NBTI; P-and N-substrate MOS capacitors; hole trapping; interface-trap; oxide-trap;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics (ICM), 2013 25th International Conference on
Conference_Location
Beirut
Print_ISBN
978-1-4799-3569-7
Type
conf
DOI
10.1109/ICM.2013.6734981
Filename
6734981
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