Title :
The Influence of Size and Composition on the Creep of SnAgCu Solder Joints
Author :
Wiese, S. ; Roellig, M. ; Mueller, M. ; Rzepka, S. ; Nocke, K. ; Luhmann, C. ; Kraemer, F. ; Meier, K. ; Wolter, K.-J.
Author_Institution :
Electron. Packaging Lab., Dresden Univ. of Technol.
Abstract :
The paper presents creep data, that was gained on non eutectic SnAgCu-solder specimens with a variety of compositions. The non eutectic SnAgCu-alloys were tested in different specimen sizes: bulk specimens, FBGA solder balls, flip chip solder joints. The results of the creep experiments show that both solder alloy composition and solder joint size have a significant influence of the creep properties of the solder material. Bulk solder specimens have a rectangular cross section of 4mm times 3mm and contained the following alloys: Sn98Ag2, Sn97Ag3, Sn96Ag4, Sn97.5Ag2Cu0.5, Sn97.1Ag2Cu0.9, Sn98.8Ag2Cu1.2, Sn96.5Ag3Cu0.5, Sn96.1Ag3Cu0.9, Sn95.8Ag3Cul.2, Sn96.9Ag3Au0.1. FBGA solder balls contained three noneutectic alloys with a content of 0.5% < Ag < 4% and 0.2% < Cu < 0.8%. Flip chip solder joints contained eutectic Sn96.5Ag3.5 alloy and an non-eutectic SnAg alloy with Ag < 3%. Creep experiments have been carried out in a temperature range between T = 5degC ... 150degC. The microstructures of the various solder specimens have been analysed to understand their differences in creep behavior
Keywords :
creep; crystal microstructure; eutectic alloys; solders; 3 mm; 4 mm; 5 to 150 C; FBGA solder balls; SnAg; SnAgAu; SnAgCu; bulk specimens; creep properties; eutectic alloys; flip chip solder joints; solder alloy composition; solder joint size; solder material; solders microstructures; Assembly; Creep; Electronics packaging; Flip chip solder joints; Shearing; Soldering; Steady-state; Stress; Temperature; Testing;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280120
