DocumentCode :
3222762
Title :
Implementation of Methods to Characterise Encapsulation Behaviour of Intended Implantable Materials
Author :
Sascha, Kammer ; Marzellus, Grobe Holthaus ; Jui-Mei, Hsu ; Peter, Koch Klaus ; Florian, Solzbacher
Author_Institution :
Neuroprosthetics Group, Fraunhofer Inst. for Biomed. Eng., St. Ingbert
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
1040
Lastpage :
1046
Abstract :
Investigation methods on polymer encapsulation materials were implemented to determine the quality of the biocompatible coating and the adhesion performance of several coating layers. Besides a general view of possible testing applications, investigations of material combinations of silicon carbide, parylene C, medical grade silicones and epoxies were carried out to qualify and quantify the layer performance. These tests were focused on tensile strength methods and shear tests. Further characterisations on the encapsulation quality of the used materials were done by using leakage current measurements. Investigations on leakage current test samples with different material combinations showed promising encapsulation behaviour of medical grade silicones and epoxies as well as silicon carbide/parylene C combination. Apart from the investigations which have been carried out, this paper shows possibilities and suggestions for future measurement methods in the field of encapsulation behaviour
Keywords :
adhesion; coatings; encapsulation; leakage currents; polymers; prosthetics; silicones; tensile strength; SiC; adhesion performance; biocompatible coating; coating layers; encapsulation behaviour; encapsulation quality; intended implantable materials; leakage current measurements; medical grade epoxies; medical grade silicones; parylene C; polymer encapsulation materials; shear tests; tensile strength methods; Adhesives; Biological materials; Biomedical materials; Coatings; Encapsulation; Leakage current; Materials testing; Medical tests; Polymer films; Silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280139
Filename :
4060864
Link To Document :
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