Title :
Comparison of the Phase Morphology for Several Sn-Ag Based Solder Ball Alloys in FBGA Packages
Author :
Leinert, S. ; Martin, N. ; Breuer, D. ; Werner, W.
Author_Institution :
Qimonda Dresden GmbH & Co.
Abstract :
In this paper the method of chemical solder removal is treated as a convenient possibility to gather information about the intermetallic compounds that form at the landing pad interfaces of solder joints. Details especially concerning the morphology of the grains can easily be overlooked or are not so easily accessible with the common approach of a cross section. Several cases are discussed where different factors influence the phase appearance
Keywords :
alloys; ball grid arrays; reflow soldering; silver; solders; tin; Ag; FBGA packages; Sn; chemical solder removal; intermetallic compounds; phase morphology; solder ball alloys; Environmentally friendly manufacturing techniques; Etching; Intermetallic; Lead; Materials testing; Morphology; Packaging; Soldering; Temperature; Tin;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280159
