Emerging From Lab to LAP: Development of Large Area Processing Technologies for Low-Cost Photonic Interconnects on PCBs

Author

Immonen, M. ; Tian, D. ; Junnila, S. ; Tarja Rapala-Virtaneir

Author_Institution

Aspocomp Oy, Espoo

Volume

2

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

1347

Lastpage

1355

Abstract

We have studied and developed technologies to embedded high-speed optical interconnects on printed circuit boards (PCB). In this paper, we show results of fabricating optical-PCBs on a production scale panels in a modern high-density interconnect-PCB (HDI-PCB) process environment. Impacts on board design and manufacturing are studied with the developed optical technology verifiers. One verifier is an optical-PCB with 3D optical routings realized with embedded waveguides, integrated i/o couplers and optical vias. Another one is a system level optical board assembly (O-PCB-A) with 10 Gb/s Tx/Rx devices on surface mounted ball grid array (BGA) modules implemented for optical link analysis. Fabricated boards are characterized of their functionality, physical characteristics and optical alignment throughout the critical optical path. Based on the results, capabilities of a modern production infrastructure to fabricate optical-PCBs and board assemblies are discussed. Focus in the analysis is on manufacturability and on factors affecting functionality, performance and yield

Keywords

assembling; ball grid arrays; integrated optoelectronics; optical interconnections; printed circuit design; printed circuit manufacture; surface mount technology; 10 Gbit/s; 3D optical routings; BGA modules; HDI-PCB process; PCB; critical optical path; embedded waveguides; high-density interconnect-PCB process; high-speed optical interconnects; integrated i/o couplers; large area processing technologies; low-cost photonic interconnects; optical alignment; optical link analysis; optical technology verifiers; optical vias; optical-PCB; printed circuit boards; surface mounted ball grid array modules; system level optical board assembly; High speed optical techniques; Integrated circuit interconnections; Integrated optics; Manufacturing; Optical design; Optical interconnections; Optical waveguides; Photonics; Printed circuits; Production;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Type

conf

DOI

10.1109/ESTC.2006.280186

Filename

4060911