DocumentCode
322458
Title
Designing the distributed architecture DIPS for cooperative software engineering
Author
Scherer, Daniel ; Murer, Tobias ; Wurtz, A.
Author_Institution
Comput. Eng. & Networks Lab., Fed. Inst. of Technol., Zurich, Switzerland
Volume
1
fYear
1997
fDate
7-10 Jan 1997
Firstpage
150
Abstract
Cooperative software engineering typically involves many actors and resources that cooperate in a complex distributed and heterogeneous world. In the DIPS (Distributed Integrated Process Services) project, a 3D model is used for the definition, enactment and tracing of software development processes, which expresses both the structure and evolution of such processes. This paper discusses how an optimal architecture was evaluated to implement the process model in a process support framework. Process-specific and general requirements are identified, and expected usage patterns of a DIPS-based environment are analyzed. A set of potential architecture variants is proposed, and implications of the requirements and usage patterns on the variants are discussed qualitatively. An evaluation of the architecture alternatives leads to the design of a hybrid DIPS architecture based on distributed heterogeneous objects. The prototype DIPS implementation is briefly outlined
Keywords
computer aided software engineering; distributed processing; groupware; 3D model; DIPS; Distributed Integrated Process Services; cooperative software engineering; distributed architecture design; distributed heterogeneous objects; expected usage patterns; hybrid architecture; object request broker; optimal architecture; process support framework; software development processes; usage patterns; Computer architecture; Computer networks; Design engineering; Distributed computing; Electronic mail; Electronics packaging; Pattern analysis; Programming; Prototypes; Software engineering; Software maintenance;
fLanguage
English
Publisher
ieee
Conference_Titel
System Sciences, 1997, Proceedings of the Thirtieth Hawaii International Conference on
Conference_Location
Wailea, HI
ISSN
1060-3425
Print_ISBN
0-8186-7743-0
Type
conf
DOI
10.1109/HICSS.1997.667209
Filename
667209
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