• DocumentCode
    3224837
  • Title

    GaN smart power chip technology

  • Author

    Chen, Kevin Jing

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2009
  • fDate
    25-27 Dec. 2009
  • Firstpage
    403
  • Lastpage
    407
  • Abstract
    Wide-bandgap GaN-based semiconductor materials are attracting considerable attention as the preferred material for power electronics applications, owning to their superior properties including high breakdown electric-field, high carrier density, high electron mobility and high saturation velocity. In this paper, the technologies for implementing GaN smart power ICs will be introduced based on the large-size, low-cost and highly scalable GaN-on-Si platform. High-voltage power components (normally-off power transistors and HEMT-compatible rectifiers) and low-voltage periphery devices for digital/analog mixed-signal circuits are successfully integrated with the same fabrication process. In particular, key analog functional blocks such as voltage reference generators and comparators are demonstrated using GaN-based technology for the first time. The optimized voltage reference generator achieved less than 70 ppm/°C drift and can be used as a reference voltage in various biasing and sensing circuits. The temperature-dependent performance of a conventional comparator is characterized and a new temperature-compensated comparator circuit is also demonstrated. The positive limiting level of the temperature-compensated comparator is less than 450 ppm/°C drift compared to 1400 ppm/°C in the conventional comparator.
  • Keywords
    carrier density; comparators (circuits); electric breakdown; electron mobility; gallium compounds; mixed analogue-digital integrated circuits; power integrated circuits; wide band gap semiconductors; GaN; breakdown electric-field; carrier density; digital/analog mixed-signal circuits; electron mobility; high-voltage power components; key analog functional blocks; optimized voltage reference generator; power electronics applications; reference voltage; saturation velocity; sensing circuits; smart power IC; smart power chip technology; temperature-compensated comparator circuit; wide-bandgap semiconductor materials; Charge carrier density; Electric breakdown; Electron mobility; Gallium nitride; Integrated circuit technology; Power electronics; Power integrated circuits; Semiconductor device breakdown; Semiconductor materials; Voltage; GaN; Wide Bandgap; power converter; smart power; voltage reference and planar integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-4297-3
  • Electronic_ISBN
    978-1-4244-4298-0
  • Type

    conf

  • DOI
    10.1109/EDSSC.2009.5394230
  • Filename
    5394230