DocumentCode
3225529
Title
IC-Stripline design optimization using response surface methodology
Author
Mandic, Tvrtko ; Gillon, Renaud ; Baric, Adrijan
Author_Institution
Fac. of Electr. Eng. & Comput., Univ. of Zagreb, Zagreb, Croatia
fYear
2013
fDate
15-18 Dec. 2013
Firstpage
69
Lastpage
73
Abstract
This paper presents design optimization of closed version of an IC-Stripline. The geometrical parameters of the IC-Stripline are optimized in order to improve VSWR performance in the frequency range up to 6 GHz. Since the optimization performed directly in 3D EM simulator is computationally expensive, the response surface methodology (RSM) based on design of experiment (DOE) is used to develop surrogate models and to accelerate IC-Stripline design optimization. The design of experiment approach is used to systematically vary geometrical parameters of the IC-Stripline structure which are then simulated in a 3D electromagnetic simulator. The equivalent model circuit parameters are extracted according to the 3D EM simulation results. The response surface formed by the extracted parameter values is modelled using a higher order polynomial. The VSWR optimization of the IC-Stripline is performed by optimizing the equivalent circuit model having the parameters defined by the response surface models. The proposed design of the IC-Stripline shows the improvement in VSWR performance over the frequency range up to 6 GHz.
Keywords
design of experiments; equivalent circuits; optimisation; polynomials; response surface methodology; strip line circuits; 3D electromagnetic simulator; DOE; IC-Stripline design optimization; RSM; VSWR optimization; design of experiment; equivalent model circuit parameters; geometrical parameters; higher order polynomial; response surface methodology; surrogate models; Electromagnetic compatibility; Equivalent circuits; Integrated circuit modeling; Optimization; Response surface methodology; Three-dimensional displays; 3D EM simulations; IC-Stripline; circuit model; response surface methodology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013 9th Intl Workshop on
Conference_Location
Nara
Type
conf
DOI
10.1109/EMCCompo.2013.6735175
Filename
6735175
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