Methodology for the thermal characterization of the MQUAD microelectronic package

Author

Guenin, Bruce M. ; Mahulikar, Deepak

Author_Institution

Olin Corp., New Haven, CT, USA

fYear

1993

fDate

2-4 Feb 1993

Firstpage

176

Lastpage

185

Abstract

Experimental and mathematical modeling techniques which were developed to characterize the thermal performance of MQUAD packages are described. The situation characterized is one of natural convection, with the package attached to a test board. The techniques described take advantage of the unique construction of the MQUAD package in order to achieve relative simplicity in their execution. Due to its low internal thermal resistance and efficient thermal coupling to the circuit board, the thermal behavior of the MQUAD package is dominated by the convective heat transfer coefficient and the thermal conductivity of the circuit board

Keywords

convection; cooling; packaging; thermal resistance; MQUAD microelectronic package; internal thermal resistance; natural convection; test board; thermal characterization; thermal conductivity; thermal coupling; thermal performance; Circuit testing; Conductivity measurement; Heat transfer; Integrated circuit packaging; Integrated circuit technology; Microelectronics; Printed circuits; Thermal conductivity; Thermal resistance; Vents;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE

Conference_Location

Austin, TX

Print_ISBN

0-7803-0863-8

Type

conf

DOI

10.1109/STHERM.1993.225316

Filename

225316