DocumentCode
3225925
Title
ZnO based thin-film transistor with high-κ gadolinium and praseodymium oxide as gate dielectric
Author
Wang, Hsiang-Chun ; Lin, Che-Kai ; Chiu, Hsien-Chin ; Kuang-Po Hsueh
Author_Institution
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
fYear
2009
fDate
25-27 Dec. 2009
Firstpage
205
Lastpage
208
Abstract
In this work, we compare the electrical and radio frequency characteristics of top-gate ZnO TFTs with praseodymium oxide layer (Pr2O3) and Gadolinium oxide layer (Gd2O3). The source/drain region of ZnO thin-film transistor is treated by simple O2 plasma instead of complicated processes, such as ion implantation and activation. By O2 plasma treatment, the source/drain series resistance successfully reduced. With Pr2O3 and Gd2O3, high dielectric constant (high-κ) insulator gate dielectrics, gate leakage current, On/OFF current ratio, and radio frequency performance successfully improved to their use for portable, battery powered, and circuit design applications. The coupling of the gate electric field is enhanced by using high-κ gate dielectrics.
Keywords
II-VI semiconductors; gadolinium compounds; high-k dielectric thin films; ion implantation; leakage currents; permittivity; plasma materials processing; praseodymium compounds; thin film transistors; zinc compounds; O2 plasma treatment; On-OFF current ratio; ZnO-Pr2O3-Gd2O3; battery powered design application; circuit design application; gadolinium oxide layer; gate electric field; gate leakage current; high dielectric constant insulator gate dielectrics; high-κ gadolinium oxide; ion implantation; praseodymium oxide layer; radio frequency characteristics; source-drain region; thin-film transistor; Batteries; Dielectrics and electrical insulation; High-K gate dielectrics; Ion implantation; Leakage current; Plasma immersion ion implantation; Plasma sources; Radio frequency; Thin film transistors; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location
Xi´an
Print_ISBN
978-1-4244-4297-3
Electronic_ISBN
978-1-4244-4298-0
Type
conf
DOI
10.1109/EDSSC.2009.5394282
Filename
5394282
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