Title :
Thermal component models for electro-thermal network simulations
Author :
Hefner, Allen R. ; Blackburn, David L.
Author_Institution :
Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Abstract :
A procedure is given for developing thermal component models for electrothermal network simulation. The simulator solves for the temperature distribution within the semiconductor devices, packages, and heat sinks (thermal network) as well as the currents and voltages within the electrical network. The thermal network is represented as an interconnection of compact thermal component models so that the system designer can readily interchange different thermal components and examine different configurations of the thermal network. The interconnection of the thermal component models is specified by the user in the same way as the interconnection of the electrical network components is specified. The thermal component models are also parameterized in terms of structural and material parameters so that the details of the heat transport physics are transparent to the user. Examples of electrothermal network simulations are given, and the temperature measurement methods used to validate the thermal component models are described
Keywords :
heat sinks; packaging; semiconductor technology; electrical network components; electro-thermal network simulations; heat sinks; heat transport physics; material parameters; packages; semiconductor devices; temperature distribution; thermal component models; Circuit simulation; Conductors; Electronic packaging thermal management; Heat sinks; Integrated circuit interconnections; NIST; Resistance heating; Semiconductor devices; Temperature distribution; Voltage;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0863-8
DOI :
10.1109/STHERM.1993.225327
