Fabrication and characterization of half-kerfed LiNbO3-based high-frequency (>100MHz) ultrasonic array transducers

Author

Zhang, J.Y. ; Xu, W.J. ; Carlier, J. ; Ji, X.M. ; Nongaillard, B. ; Queste, S. ; Zhou, J. ; Huang, Y.P.

Author_Institution

Dept. Opto-Acousto-Electron., Univ. de Valenciennes Mont Houy, Valenciennes, France

fYear

2011

fDate

18-21 Oct. 2011

Firstpage

1727

Lastpage

1730

Abstract

The effect of kerf depth is investigated on the performances of array transducers. A finite element tool, COMSOL, is employed to simulate the properties of acoustic field and to calculate the electrical properties of the arrays, including crosstalk effect and electrical impedance. Furthermore, Inductively Coupled Plasma (ICP) deep etching process is used to etch 36°/Y-cut lithium niobate (LiNbO₃) crystals and the limitation of etching aspect ratio is studied. Several arrays with different profiles are realized under optimized processes. At last, arrays with different pitches are fabricated and characterized by a network analyzer.

Keywords

electric impedance; finite element analysis; lithium compounds; sputter etching; ultrasonic transducer arrays; COMSOL; LiNbO₃; acoustic field properties; crosstalk effect; electrical impedance; electrical properties; finite element tool; half-kerfed high-frequency ultrasonic array transducers; inductively-coupled plasma deep etching; kerf depth effect; lithium niobate crystals; Acoustics; Arrays; Crosstalk; Etching; Finite element methods; Focusing; Lithium niobate;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium (IUS), 2011 IEEE International

Conference_Location

Orlando, FL

ISSN

1948-5719

Print_ISBN

978-1-4577-1253-1

Type

conf

DOI

10.1109/ULTSYM.2011.0431

Filename

6293300