Title :
A room temperature flip-chip mounting technique for laser diodes on silicon motherboards
Author :
Vanwassenhove, Luc ; Van Daele, Peter
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
fDate :
30 Oct-2 Nov 1995
Abstract :
In this presentation, a relatively simple mounting method is suggested for flip-chip mounting of arrays of edge-emitting laser diodes to arrays of fibers. What really makes the difference with known methods is the use of a room temperature mounting process using a transparent UV-curing, non conducting glue for the fixation of arrays of laser diodes. Apart from power budget problems, the only problem to be solved was the influence of the glue on the laser facets. This has been solved by the application of coatings
Keywords :
flip-chip devices; integrated optoelectronics; optical communication equipment; optical fabrication; optical films; semiconductor device packaging; semiconductor laser arrays; semiconductor technology; coatings; edge-emitting laser diodes; fiber array coupling; laser diodes; mounting method; non conducting glue; power budget problems; room temperature flip-chip mounting technique; room temperature mounting process; silicon motherboards; transparent UV-curing; Coatings; Curing; Diode lasers; Gold; Optical arrays; Optical fiber devices; Semiconductor laser arrays; Silicon; Surface emitting lasers; Temperature;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2450-1
DOI :
10.1109/LEOS.1995.484629
