Title :
Electrical performance of glass interposer-based 3D packaging: Modeling and simulations
Author :
El Amrani, A. ; El Bouhali, M. ; Bouya, M. ; Benali, A. ; Faqir, M. ; Hadjoudja, A. ; Ghogho, M.
Author_Institution :
R&D, Int. Univ. of Rabat, Sala al jadida, Morocco
Abstract :
For cell phone cameras the glass is a promising material as an interposer for 3D microelectronic and multifunctional packaging thanks to its insulation proprieties. Compared to silicon, glass provides better electrical performances. In this work, we present a new electrical modeling approach, based on physical parameters, for the glass interposer with through package vias (TPV). First, we develop a model that takes into consideration the parasitic effects which represent a serious drawback for high frequency applications. The interesting feature of this model is its ability to convert physical weaknesses into electrical characteristics. We simulate the insertion loss induced within the TPV structure and we compare the results with the insertion loss induced within trough silicon vias (TSV). Finally we design a model to simulate the Crosstalk between two neighbor TPVs.
Keywords :
cameras; glass; insulation; integrated circuit packaging; smart phones; three-dimensional integrated circuits; 3D microelectronic packaging; TPV structure; cell phone cameras; electrical modeling approach; electrical performances; glass interposer-based 3D packaging; high frequency applications; insertion loss; insulation proprieties; multifunctional packaging; parasitic effects; physical parameters; through package vias; Adaptation models; Polymers; Predictive models; Software; Solid modeling; Three-dimensional displays; Universal Serial Bus; Electrical modeling; Glass interposer; Through package via;
Conference_Titel :
Electrical and Information Technologies (ICEIT), 2015 International Conference on
Conference_Location :
Marrakech
Print_ISBN :
978-1-4799-7478-8
DOI :
10.1109/EITech.2015.7162930