DocumentCode
3228533
Title
Simultaneous tuning of tunnel resistance of integrated nanogaps by field-emission-induced electromigration
Author
Ito, Mitsuki ; Ueno, Shunsuke ; Watanabe, Takato ; Akimoto, Shunsuke ; Shirakashi, Jun-ichi
Author_Institution
Dept. of Electr. & Electron. Eng., Tokyo Univ. of Agric. & Technol., Koganei, Japan
fYear
2011
fDate
15-18 Aug. 2011
Firstpage
260
Lastpage
263
Abstract
We report a simple and easy method for the simultaneous control of electrical properties of multiple Ni nanogaps. This method is based on electromigration induced by a field emission current, which is the so-called “activation.” The tuning of tunnel resistance of nanogaps was simultaneously achieved by passing a Fowler-Nordheim (F-N) field emission current through three initial Ni nanogaps connected in series. The Ni nanogaps having an asymmetrical shape with the separation of 80-110 nm were fabricated by electron-beam (EB) lithography and lift-off process. By performing the activation, current-voltage properties of series-connected nanogaps were simultaneously varied from “insulating” to “metallic” through “tunneling” properties with increasing the preset current of the activation. Furthermore, the tunnel resistance of simultaneously activated nanogaps decreased from the order of 100 TΩ to 100 kΩ with increasing the preset current from 1 nA to 30 μA. Scanning electron microscopy (SEM) images of the nanogaps after performing the activation with the final preset current Is of 30 μA clearly indicated that the separation of the gaps reduces to less than 10 nm after the activation. These results clearly imply that the electrical properties of series-connected nanogaps can be simultaneously tuned by the activation procedure.
Keywords
electrical resistivity; electromigration; electron beam lithography; field emission; metal-insulator transition; nanofabrication; nanolithography; nanostructured materials; nickel; scanning electron microscopy; tunnelling; Fowler-Nordheim field emission current; Ni; current 1 nA to 30 muA; current-voltage properties; electrical properties; electron-beam lithography; field-emission-induced electromigration; integrated nanogaps; lift-off process; resistance 100 Tohm to 100 kohm; scanning electron microscopy; series-connected nanogaps; tunnel resistance; Electrodes; Electromigration; Fabrication; Nickel; Resistance; Scanning electron microscopy; Single electron transistors; Electromigration; Field emission current; Integration; Nanogap; Single-electron transistor;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on
Conference_Location
Portland, OR
ISSN
1944-9399
Print_ISBN
978-1-4577-1514-3
Electronic_ISBN
1944-9399
Type
conf
DOI
10.1109/NANO.2011.6144515
Filename
6144515
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