• DocumentCode
    3229115
  • Title

    Efficient numerical modeling of random rough surface effects for interconnect internal impedance extraction

  • Author

    Chen, Quan ; Wong, Ngai

  • Author_Institution
    Univ. of Hong Kong, Hong Kong
  • fYear
    2008
  • fDate
    21-24 March 2008
  • Firstpage
    152
  • Lastpage
    157
  • Abstract
    This paper proposes an efficient model for numerically evaluating the impact of random surface roughness on the internal impedance for large-scale interconnect structures. The effective resistivity (ER) and effective permeability (EP) are numerically formulated to avoid the computationally prohibitive global discretization, while maintaining the model accuracy and flexibility. A modified stochastic integral equation (SIE) method is proposed to significantly speed up the computation for the mean values of ER and EP under the assumption of random surface roughness. Numerical experiments then verify the efficacy of our approach.
  • Keywords
    electric impedance; electrical resistivity; integral equations; integrated circuit interconnections; permeability; stochastic processes; surface roughness; effective permeability; effective resistivity; interconnect internal impedance extraction; numerical modeling; random surface roughness; stochastic integral equation method; Conductivity; Erbium; Integral equations; Large-scale systems; Numerical models; Permeability; Rough surfaces; Stochastic processes; Surface impedance; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-1921-0
  • Electronic_ISBN
    978-1-4244-1922-7
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2008.4483930
  • Filename
    4483930