DocumentCode
3229115
Title
Efficient numerical modeling of random rough surface effects for interconnect internal impedance extraction
Author
Chen, Quan ; Wong, Ngai
Author_Institution
Univ. of Hong Kong, Hong Kong
fYear
2008
fDate
21-24 March 2008
Firstpage
152
Lastpage
157
Abstract
This paper proposes an efficient model for numerically evaluating the impact of random surface roughness on the internal impedance for large-scale interconnect structures. The effective resistivity (ER) and effective permeability (EP) are numerically formulated to avoid the computationally prohibitive global discretization, while maintaining the model accuracy and flexibility. A modified stochastic integral equation (SIE) method is proposed to significantly speed up the computation for the mean values of ER and EP under the assumption of random surface roughness. Numerical experiments then verify the efficacy of our approach.
Keywords
electric impedance; electrical resistivity; integral equations; integrated circuit interconnections; permeability; stochastic processes; surface roughness; effective permeability; effective resistivity; interconnect internal impedance extraction; numerical modeling; random surface roughness; stochastic integral equation method; Conductivity; Erbium; Integral equations; Large-scale systems; Numerical models; Permeability; Rough surfaces; Stochastic processes; Surface impedance; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific
Conference_Location
Seoul
Print_ISBN
978-1-4244-1921-0
Electronic_ISBN
978-1-4244-1922-7
Type
conf
DOI
10.1109/ASPDAC.2008.4483930
Filename
4483930
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