DocumentCode :
3229115
Title :
Efficient numerical modeling of random rough surface effects for interconnect internal impedance extraction
Author :
Chen, Quan ; Wong, Ngai
Author_Institution :
Univ. of Hong Kong, Hong Kong
fYear :
2008
fDate :
21-24 March 2008
Firstpage :
152
Lastpage :
157
Abstract :
This paper proposes an efficient model for numerically evaluating the impact of random surface roughness on the internal impedance for large-scale interconnect structures. The effective resistivity (ER) and effective permeability (EP) are numerically formulated to avoid the computationally prohibitive global discretization, while maintaining the model accuracy and flexibility. A modified stochastic integral equation (SIE) method is proposed to significantly speed up the computation for the mean values of ER and EP under the assumption of random surface roughness. Numerical experiments then verify the efficacy of our approach.
Keywords :
electric impedance; electrical resistivity; integral equations; integrated circuit interconnections; permeability; stochastic processes; surface roughness; effective permeability; effective resistivity; interconnect internal impedance extraction; numerical modeling; random surface roughness; stochastic integral equation method; Conductivity; Erbium; Integral equations; Large-scale systems; Numerical models; Permeability; Rough surfaces; Stochastic processes; Surface impedance; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-1921-0
Electronic_ISBN :
978-1-4244-1922-7
Type :
conf
DOI :
10.1109/ASPDAC.2008.4483930
Filename :
4483930
Link To Document :
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