• DocumentCode
    3230685
  • Title

    A millimeter-wave solid-state power combining circuit based on low-loss corporate waveguide structure

  • Author

    Ran, Dong ; Xu, Jun ; Wang, Lei ; Wang, Maoyan

  • Author_Institution
    Sch. of Phys. Electron., Univ. of Electron. Sci. & Technol. of China, Cheng du, China
  • fYear
    2010
  • fDate
    8-11 May 2010
  • Firstpage
    208
  • Lastpage
    210
  • Abstract
    In this paper, we present a Ka-band (30 GHz-35 GHz) solid-state power combining circuit using 4 low-power amplifier modules. By using low-loss waveguide power dividing/combining network and a monolithic microwave integrated circuit (MMIC) with a low-loss microstrip-to-waveguide transition, the combining circuit output loss is minimized, so a high combining efficiency larger than 85% from 30 GHz to 35 GHz is achieved. Measured results show a good agreement with simulated results. Meanwhile the new combing structure shows many advantages, such as easy assembling and maintenance, excellent heat-sink capacity, a strong potential for higher power and higher frequency. Modular architecture is adopted in the combiner design, adding great flexibility to circuit operation. Modular amplifiers can be premade and reserved in case any malfunctioning amplifier needs to be replaced.
  • Keywords
    MMIC; microstrip transitions; millimetre wave circuits; power amplifiers; power combiners; waveguide transitions; Ka-band; MMIC; frequency 30 GHz to 35 GHz; heat-sink capacity; low-loss corporate waveguide structure; low-power amplifier module; microstrip-to-waveguide transition; millimeter-wave circuit; monolithic microwave integrated circuit; solid-state power combining circuit; waveguide power dividing-combining network; Electromagnetic heating; Integrated circuit measurements; MMICs; Microstrip; Microwave integrated circuits; Millimeter wave circuits; Millimeter wave integrated circuits; Monolithic integrated circuits; Solid state circuits; Waveguide transitions; Ka-band; Power combining; corporate waveguide structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5705-2
  • Type

    conf

  • DOI
    10.1109/ICMMT.2010.5524903
  • Filename
    5524903