DocumentCode :
3231821
Title :
Predicting failing bitmap signatures for memory arrays with critical area analysis
Author :
Segal, Julie D. ; Ho, Tom ; Hodgkins, Bob ; Misic, Petar ; Lin, James ; Yegnashankaran, Mohan
Author_Institution :
HPL Inc., San Jose, CA, USA
fYear :
1999
fDate :
1999
Firstpage :
178
Lastpage :
182
Abstract :
Using in-line defect data, critical area analysis of cell layout, and a rule-based algorithm to associate critical areas with electrical faults, we can predict failing bitmap signatures and their frequencies for any memory circuit. The technique is demonstrated using a 0.25 μm SRAM technology. Results can be used for test optimization, redundancy planning, yield prediction, and determining process steps responsible for yield loss
Keywords :
SRAM chips; cellular arrays; failure analysis; integrated circuit layout; integrated circuit reliability; integrated circuit yield; integrated memory circuits; probability; redundancy; 0.25 micron; SRAM technology; cell layout; critical area analysis; electrical faults; failing bitmap signatures prediction; inline defect data; memory arrays; redundancy planning; rule-based algorithm; test optimization; yield loss; yield prediction; Algorithm design and analysis; Circuit faults; Circuit simulation; Data mining; Failure analysis; Frequency; Predictive models; Probability; Redundancy; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-5217-3
Type :
conf
DOI :
10.1109/ASMC.1999.798216
Filename :
798216
Link To Document :
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