Using coarse/fine manipulation with vision to place fine pitch SMD components

Author

Baartman, J.P. ; Brennemann, A.E. ; Buckley, S.J. ; Moed, M.C.

fYear

1989

fDate

25-27 Sep 1989

Firstpage

262

Lastpage

266

Abstract

An experimental system that can accurately align and place SMDs (surface mount devices) on a printed circuit board is described. Features of the system are fine positioning and endpoint sensing after an IBM 7576 robot coarsely aligns the SMD to its target. Fine positioning is done using a customer-designed micropositioning device. The endpoint sensor is a single camera vision system that by image analysis determines the alignment error of the SMD to the board. System performance was evaluated by placing SMDs of 100 leads with 25 mil lead spacing on a board. The alignment error is less than 0.5 mil and 0.015°, independent of feeder and board position error or robot repeatability. The average cycle time is less than 10 s

Keywords

assembling; computer vision; industrial robots; surface mount technology; IBM 7576 robot; alignment error; average cycle time; board position error; customer-designed micropositioning device; endpoint sensing; fine pitch SMD components; fine positioning; image analysis; lead spacing; placement; printed circuit board; robot repeatability; single camera vision system; Assembly; Cameras; Hardware; Lead; Manufacturing automation; Packaging machines; Printed circuits; Robot sensing systems; Robot vision systems; System performance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/EMTS.1989.68986

Filename

68986