• DocumentCode
    3232302
  • Title

    Comparison between scanning acoustic microscopy and submillimeter spectroscopy. A new opportunity to investigate dielectric behavior and structure of materials

  • Author

    Maev, R.G. ; Levin, V.M. ; Maeva, E.Yu. ; Volkov, A.A. ; Kozlov, G.V. ; Goncharov, Yu.G. ; Gorshunov, B.P.

  • Author_Institution
    Center of Acoust. Microscopy, Acad. of Sci., Moscow, Russia
  • Volume
    2
  • fYear
    1996
  • fDate
    20-23 Oct 1996
  • Firstpage
    554
  • Abstract
    In acoustic microscopy, ultrasound and hypersound range waves (10 MHz-2 GHz) are used as the analysis factor. The following trends in the development of this method for polymers seem promising: morphology of smooth surfaces with nonuniform distribution of physical and mechanical properties, measurements of local anisotropy, study of dynamic phenomena connected with the change in materials due to physical factors (temperature, UV, IR, SHF-radiation), mechanical and chemical factors. In the field of submillimeter spectroscopy we have developed a spectrometer capable of performing dielectric measurements in solids in the previously inaccessible region of millimeter-submillimeter wavelengths (3-0.3 mm). The spectrometer employs intensive frequency tunable radiation from a Backward-Wave Oscillator (BWO) in combination with optical contactless measuring schemes, which realizes the most efficient advantages of infrared spectroscopy and conventional microwave technique: precise, independent measurements of the real ε´ and imaginary ε´´ parts of the spectra in a wide frequency range
  • Keywords
    acoustic microscopy; dielectric measurement; organic insulating materials; polymers; submillimetre wave measurement; submillimetre wave spectroscopy; surface structure; surface topography measurement; ultrasonic applications; 0.3 to 3 mm; 10 MHz to 2 GHz; backward-wave oscillator; bulk structure; dielectric measurements; dynamic phenomena; hypersound range; intensive frequency tunable radiation; local anisotropy measurement; optical contactless measuring schemes; polymers; scanning acoustic microscopy; smooth surface morphology; submillimeter spectroscopy; surface structure; ultrasound range; wide frequency range; Acoustic waves; Dielectric measurements; Electrochemical impedance spectroscopy; Frequency measurement; Microscopy; Microwave measurements; Morphology; Polymers; Ultrasonic imaging; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1996., IEEE 1996 Annual Report of the Conference on
  • Conference_Location
    Millbrae, CA
  • Print_ISBN
    0-7803-3580-5
  • Type

    conf

  • DOI
    10.1109/CEIDP.1996.564532
  • Filename
    564532