Title :
Scattering parameters analysis of the vertical Interconnected via in microwave multilayer circuits
Author :
Tian, Yu ; Liu, Yu ; Tong, Ling
Author_Institution :
Coll. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
The paper presents the scattering parameters analysis of the vertical Interconnected vias in microwave multilayer circuits. The vertical Interconnected vias can be divided into two parts which are known as the exterior structure and the interior structure and whose scattering parameters can be analyzed separately by the matrix-penciled moment method (MP-MOM)and the equivalent impedance method in parallel planes. The general design rules have been summarized about vertical Interconnected vias in microwave multilayer circuits in the paper.
Keywords :
S-parameters; method of moments; microwave circuits; multilayers; design rules; equivalent impedance method; matrix-penciled moment method; microwave multilayer circuit; parallel planes; scattering parameters analysis; vertical interconnected via; Automation; Educational institutions; Frequency; Integrated circuit interconnections; Microwave circuits; Moment methods; Nonhomogeneous media; Printed circuits; Scattering parameters; Transmission line matrix methods;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5705-2
DOI :
10.1109/ICMMT.2010.5525065
