Use of JTAG boundary-scan for testing electronic circuit boards and systems

Todaypsilas complex printed circuit boards and high-density ball-grid array and other chip-size package ICs have led to the standardization and wide-spread use of JTAG (Joint Test Action Group) boundary-scan technology for test and debug. Topics include the evolution of JTAG standards, basic fundamentals of boundary-scan architecture, board testability using boundary-scan and system-level testing. Additionally, this paper will address the advantages and disadvantages of JTAG testing and propose advanced JTAG test methodologies including remote testing and diagnostics.