DocumentCode
3234479
Title
Feasibility of elastic and compositional characterization of an arterial plaque by dual mechanical strain and thermal strain imaging using a single ultrasound probe
Author
Dutta, Debaditya ; Mahmoud, Ahmed M. ; Kim, And Kang
Author_Institution
Center for Ultrasound Mol. Imaging & Therapeutics, Univ. of Pittsburgh, Pittsburgh, PA, USA
fYear
2011
fDate
18-21 Oct. 2011
Firstpage
1774
Lastpage
1777
Abstract
Vulnerable plaques are often identified with a lipid pool, which is characterized by its mechanical and compositional contrast to the surrounding water bearing tissues. Ultrasound (US) elasticity imaging (UEI) can assess the elastic property by measuring mechanical strain induced by cardiac pulsation, and US thermal strain imaging (TSI) can determine the lipid contents of the plaque by measuring thermal strain induced by sound speed change due to temperature increase. In this study, the feasibility of dual UEI and TSI using a single US linear array to assess both elasticity and composition of a plaque is demonstrated by in silico simulation and in-vitro water tank experiments.
Keywords
biomedical optical imaging; biomedical ultrasonics; blood vessels; cardiology; elasticity; haemodynamics; haemorheology; infrared imaging; lipid bilayers; medical image processing; pulsatile flow; strain measurement; ultrasonic imaging; arterial plaque; cardiac pulsation; compositional characterization; compositional contrast; dual mechanical strain; elastic characterization; elastic property; in silico simulation; in-vitro water tank experiments; lipid pool; mechanical contrast; mechanical strain measurement; pulsatile blood flow; single ultrasound linear array; single ultrasound probe; sound speed; thermal strain imaging; ultrasound elasticity imaging; water bearing tissues; Acoustics; Heating; Imaging; Lipidomics; Radio frequency; Strain; Ultrasonic imaging; Atherosclerotic Plaques; Elasticity Imaging; Lipid Detection; Thermal Strain Imaging; Vulnerable Plaques;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location
Orlando, FL
ISSN
1948-5719
Print_ISBN
978-1-4577-1253-1
Type
conf
DOI
10.1109/ULTSYM.2011.0443
Filename
6293641
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