DocumentCode :
3234486
Title :
Monte Carlo Simulation of Boron Implantation into (100) Germanium
Author :
Wittmann, R. ; Hossinger, A. ; Cervenka, J. ; Uppal, S. ; Selberherr, S.
Author_Institution :
Inst. for Microelectron., TU Wien
fYear :
2006
fDate :
6-8 Sept. 2006
Firstpage :
381
Lastpage :
384
Abstract :
We present a Monte Carlo simulation study for introducing boron ions into Ge in the energy range from 5 to 40 keV. The successful calibration of our ion implantation simulator for crystalline Ge is demonstrated by comparing the predicted boron profiles with SIMS measurements. The generation of point defects are calculated with a modified Kinchin-Pease damage model. An implanted boron profile in Ge is shallower than in Si for any given energy due to the larger nuclear and electronic stopping power of Ge atoms. We found that the higher displacement energy in Ge, the stronger backscattering effect, and the smaller energy transfer from the ion to the primary recoil of a collision cascade are mainly responsible for the significantly reduced damage in Ge
Keywords :
Monte Carlo methods; backscatter; boron; calibration; elemental semiconductors; energy loss of particles; germanium; ion implantation; point defects; semiconductor device manufacture; 5 to 40 keV; Ge:B; Kinchin-Pease damage model; Monte Carlo simulation; backscattering effect; boron implantation; calibration; collision cascade; electronic stopping power; germanium; ion implantation simulator; point defect; Atomic measurements; Backscatter; Boron; Calibration; Crystallization; Germanium; Ion implantation; Nuclear electronics; Nuclear power generation; Predictive models;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
1-4244-0404-5
Type :
conf
DOI :
10.1109/SISPAD.2006.282914
Filename :
4061657
Link To Document :
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