Title :
HfO2 high-k dielectric layers in air-coupled capacitive ultrasonic transducers
Author :
McSweeney, Sean G. ; Wright, William M D
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. Coll. Cork, Cork, Ireland
Abstract :
For air-coupled applications, broadband capacitive ultrasonic transducers (CUTs) at the mm to cm scale are often desirable. Improved device performance may be obtained by etching well-defined geometric features into a silicon backplate electrode, then using a metallized polymer film as the other electrode. The use of additional dielectric coatings for devices at this scale may have a number of beneficial effects. This work investigates the use of HfO2 high-k dielectric coatings on the backplate electrodes of air-coupled CUTs. A range of such devices was constructed and used in a through-transmission configuration. Different thickness HfO2 layers were investigated at different bias voltages, and the effects on the sensitivity and bandwidth of the devices were analyzed. The predicted capacitance of each device was within 7% of the measured capacitance, with variations due to additional trapped air and manual assembly. Increasing the HfO2 layer thickness decreased the overall capacitance of the CUT as expected, but produced significant improvements in device sensitivity and bandwidth at certain bias voltages. A strong correlation between HfO2 high-k dielectric layer thickness and peak-to-peak amplitude was observed. The variation in device operation after successive bias charge/discharge cycles also become consistently less as the HfO2 layer thickness was increased.
Keywords :
capacitive sensors; electrodes; hafnium compounds; high-k dielectric thin films; metallisation; polymer films; ultrasonic transducers; HfO2; HfO2 high-k dielectric layers; air-coupled capacitive ultrasonic transducers; bandwidth effects; bias charge-discharge cycles; bias voltages; broadband capacitive ultrasonic transducers; device capacitance; device operation variation; dielectric coatings; etching; manual assembly; metallized polymer film; peak-to-peak amplitude; sensitivity effects; silicon backplate electrode; trapped air; Capacitance; Dielectrics; Electrodes; Hafnium compounds; High K dielectric materials; Silicon; Ultrasonic transducers; High-k dielectric; air coupled ultrasound; capacitive ultrasonic transducer; hafnium oxide;
Conference_Titel :
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1253-1
DOI :
10.1109/ULTSYM.2011.0211