Title :
Fatigue and Creep in Solder Joints
Author :
Homa, Thomas R. ; Huebner, R. Terry
Author_Institution :
IBM Corporation, Endicott, NY
Keywords :
Capacitors; Creep; Data engineering; Design engineering; Fatigue; Life testing; Packaging; Soldering; Surface-mount technology; Vents;
Conference_Titel :
Southern Tier Technical Conference, 1987. Proceedings of the 1987 IEEE
DOI :
10.1109/STIER.1987.716359
