• DocumentCode
    3236352
  • Title

    Effects of ion implantation on dielectric charging in PECVD silicon nitride films for RF MEMS switches application

  • Author

    Li, Gang ; Zhan, Linxian ; San, Haisheng ; Xu, Peng ; Chen, Xuyuan

  • Author_Institution
    Sch. of Phys. & Mech. & Electr. Eng., Xiamen Univ., Xiamen
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    1015
  • Lastpage
    1019
  • Abstract
    In this work phosphorus or boron ions were implanted into dielectric layer by ion implantation. The impurity energy levels are introduced into the band gap of dielectric layer, thus the scattering processes of trapped charges in the dielectric layer can be changed, which lead to the change of relaxation time. In our experiment, we focus on investigation of the mechanisms of the charge accumulation and recombination after the charge injected into the dielectric layers. Metal-insulator-semiconductor (MIS) structure is used in our experiments. Silicon nitride films as the insulator in MIS structure were deposited by PECVD process. The space charge accumulation and dissipation in the silicon nitride film can be characterized by C-V measurement qualitatively.
  • Keywords
    MIS structures; boron; dielectric thin films; ion implantation; microswitches; phosphorus; plasma CVD; silicon compounds; C-V measurement; MIS structure; PECVD film; RF MEMS switches application; SiN; band gap; dielectric charging; ion implantation; metal-insulator-semiconductor structure; scattering processes; Boron; Dielectrics; Energy states; Impurities; Ion implantation; Photonic band gap; Radiofrequency microelectromechanical systems; Semiconductor films; Silicon; Switches; Charge accumulation; Ion implantation; PECVD; RF MEMS Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484493
  • Filename
    4484493