DocumentCode
3236352
Title
Effects of ion implantation on dielectric charging in PECVD silicon nitride films for RF MEMS switches application
Author
Li, Gang ; Zhan, Linxian ; San, Haisheng ; Xu, Peng ; Chen, Xuyuan
Author_Institution
Sch. of Phys. & Mech. & Electr. Eng., Xiamen Univ., Xiamen
fYear
2008
fDate
6-9 Jan. 2008
Firstpage
1015
Lastpage
1019
Abstract
In this work phosphorus or boron ions were implanted into dielectric layer by ion implantation. The impurity energy levels are introduced into the band gap of dielectric layer, thus the scattering processes of trapped charges in the dielectric layer can be changed, which lead to the change of relaxation time. In our experiment, we focus on investigation of the mechanisms of the charge accumulation and recombination after the charge injected into the dielectric layers. Metal-insulator-semiconductor (MIS) structure is used in our experiments. Silicon nitride films as the insulator in MIS structure were deposited by PECVD process. The space charge accumulation and dissipation in the silicon nitride film can be characterized by C-V measurement qualitatively.
Keywords
MIS structures; boron; dielectric thin films; ion implantation; microswitches; phosphorus; plasma CVD; silicon compounds; C-V measurement; MIS structure; PECVD film; RF MEMS switches application; SiN; band gap; dielectric charging; ion implantation; metal-insulator-semiconductor structure; scattering processes; Boron; Dielectrics; Energy states; Impurities; Ion implantation; Photonic band gap; Radiofrequency microelectromechanical systems; Semiconductor films; Silicon; Switches; Charge accumulation; Ion implantation; PECVD; RF MEMS Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location
Sanya
Print_ISBN
978-1-4244-1907-4
Electronic_ISBN
978-1-4244-1908-1
Type
conf
DOI
10.1109/NEMS.2008.4484493
Filename
4484493
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