• DocumentCode
    3238530
  • Title

    Measurement of electron and hole impact ionization coefficients for SiC

  • Author

    Raghunathan, R. ; Baliga, B.J.

  • Author_Institution
    Power Semiconductor Res. Center, North Carolina State Univ., Raleigh, NC, USA
  • fYear
    1997
  • fDate
    26-29 May 1997
  • Firstpage
    173
  • Lastpage
    176
  • Abstract
    Silicon carbide has received increasing attention for power switching, microwave and high temperature applications due to its high breakdown electric field, thermal conductivity and electron saturation drift velocity. One of the most important parameters of a SiC power device is its breakdown voltage. In order to obtain a clear understanding of its breakdown characteristics, it is important to have an exact knowledge of the impact ionization coefficients for SiC. However, there is very little information available in literature for 6H-SiC and none for 4H-SiC. In this work, measured impact ionization coefficient data for 4H and 6H-SiC are provided as a function of temperature. It is demonstrated that that the data obtained from these measurements allows a more accurate simulation of reverse breakdown voltage characteristics than that obtained using previously published data. These results have widespread utility for SiC device analysis and design
  • Keywords
    electric breakdown; impact ionisation; power semiconductor switches; semiconductor materials; silicon compounds; thermal conductivity; SiC; breakdown voltage; device analysis; electron impact ionization coefficients; electron saturation drift velocity; hole impact ionization coefficients; power switching; reverse breakdown voltage characteristics; thermal conductivity; Charge carrier processes; Electric breakdown; Electric variables measurement; Electron beams; Impact ionization; Pulse measurements; Schottky diodes; Silicon carbide; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
  • Conference_Location
    Weimar
  • ISSN
    1063-6854
  • Print_ISBN
    0-7803-3993-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.1997.601463
  • Filename
    601463