Mixed technologies for microwave multichip module (MMCM) applications-a review

Extensive use of MMICs and T/R (Transmit/Receive) modules in systems for commercial and military communications are demanding low weight, critical dimensions governed by antenna grid spacing, cost and reliability. Those requirements have led major companies to develop “mixed” packaging technologies. “Mixed” means that: combined signals like high frequency and low power logic control signals are propagating on the same substrate and/or that the technologies used to meet all the requirements are of different kinds (MCM-C/D for example). The various technologies used in recent developments are reviewed and discussed in terms of electrical performances, packaging type, design rules, and ability to integrate passive components (i.e. resistors, inductors or capacitors). Examples of T/R modules like smart packages from major American and European companies are presented and discussed. An application of double sided thin film/thick film multilayer substrates developed by Dassault Electronique for military and space applications is presented