Thermal sensitivity analysis of on-chip interconnects

Author

Guang-Cao Fu ; Min Tang ; Jia-Qing Lu ; Jun-Fa Mao

Author_Institution

Key Lab. of Minist. of Educ. of China for Res. of Design & Electromagn. Compatibility of High Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China

Volume

50

Issue

11

fYear

2014

fDate

May 22 2014

Firstpage

797

Lastpage

799

Abstract

A new method for time-domain sensitivity analysis of on-chip coupled interconnects with non-uniform substrate temperature profiles is presented. The parametric macromodelling is performed via multivariate rational approximation using magnitude vector fitting algorithms. The waveform relaxation algorithm with transverse partitioning is employed for efficient sensitivity analysis of coupled interconnects. With these techniques, the thermal sensitivity of on-chip global interconnects arising from typical substrate thermal profiles are investigated.

Keywords

approximation theory; integrated circuit interconnections; integrated circuit modelling; iterative methods; sensitivity analysis; thermal management (packaging); time-domain analysis; vectors; magnitude vector fitting algorithm; multivariate rational approximation; nonuniform substrate temperature profile; on-chip coupled interconnection; parametric macromodelling; substrate thermal profile; thermal sensitivity analysis; time-domain sensitivity analysis; transverse partitioning; waveform relaxation algorithm;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el.2014.0517

Filename

6824361