DocumentCode
3239707
Title
Performances of thermal transfer printing and their improvement by model calculations
Author
Drees, F.W. ; Grethen, H. ; Nisius, R. ; Pekruhn, W.
Author_Institution
Siemens AG, Berlin, West Germany
fYear
1989
fDate
8-12 May 1989
Firstpage
14642
Lastpage
15373
Abstract
The thermodynamic behavior of a thin-film multilayer structure is calculated under stress of a periodical powered electrical heat source. The model is used to optimize the print quality, lifetime, and efficiency of a thermal-transfer printhead. The modeling task involves the adaptation of the printing conditions (pulse power, timing, and mechanical forces) to the thermal and mechanical properties of the printhead, with the aim of good print quality, high printing speed, low power consumption, and a high lifetime of the printhead. The calculations were done in one dimension on the basis of the heat-transfer equation. Numerical solutions were found with Euler´s method, while the material constants were taken from literature. The results are shown to be in good agreement with IR-microscope measurements. The technology has been realised in the Siemens PT 34 thermal transfer page printer
Keywords
thermal printers; Siemens PT 34; efficiency; heat-transfer equation; lifetime; periodical powered electrical heat source; print quality; printing speed; thermal transfer page printer; thermal transfer printing; thermal-transfer printhead; thermodynamic behavior; thin-film multilayer structure; Energy consumption; Mechanical factors; Nonhomogeneous media; Printing; Resistance heating; Thermal force; Thermal stresses; Thermodynamics; Timing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings.
Conference_Location
Hamburg
Print_ISBN
0-8186-1940-6
Type
conf
DOI
10.1109/CMPEUR.1989.93368
Filename
93368
Link To Document