DocumentCode :
3239711
Title :
Wave soldering using a no-clean process
Author :
Down, W.H.
Author_Institution :
Electrovert USA Corp., USA
fYear :
1995
fDate :
10-12 Oct 1995
Firstpage :
350
Lastpage :
353
Abstract :
The accelerated interest in adopting a no-clean soldering process is due not only to the rapid phase out of CFC cleaning but also because it can be a very cost effective process. However, the use of no-clean fluxes, typically with 2% solids, presents some special challenges to the soldering equipment, process control and even to the product being soldered. This paper examines these challenges in detail and discusses possible solutions. Some of the items discussed include flux application and control, preheating techniques, solder wave dynamics and the benefits of inerting the process
Keywords :
printed circuit manufacture; wave soldering; PC assembly; cost effective process; flux application; flux control; forced convection preheating; no-clean process; preheating techniques; process control; selective inerting; solder wave dynamics; soldering equipment; volatile organic compound free flux; wave soldering; Assembly; Containers; Control systems; Costs; Gravity; Magnetic heads; Monitoring; Soldering; Solids; Spraying;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Northcon 95. I EEE Technical Applications Conference and Workshops Northcon95
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-2639-3
Type :
conf
DOI :
10.1109/NORTHC.1995.485095
Filename :
485095
Link To Document :
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