Title :
Design of a multilevel DRAM with adjustable cell capacity
Author :
Xiang, Yunan ; Cockburn, Bruce F. ; Elliott, Duncan G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
Abstract :
A multilevel DRAM (MLDRAM) increases the per-cell storage capacity over conventional DRAM by using more than two cell signal levels. The key challenge when designing an MLDRAM is to ensure reliable operation using the more closely spaced signal levels despite the presence of on-chip noise and the inevitable small variations in circuit parameters that occur in integrated circuit (IC) production. This paper describes a test chip that implements an inherently balanced and robust MLDRAM scheme proposed by Birk et al. (see 1999 IEEE Int. Workshop on Memory Tech., Design and Testing, San Jose, CA, USA, p.102-109.). The chip has an adjustable cell capacity that can be selected from among 1, 1.5, 2 and 2.5 bits per cell. Fractional bits arise when groups of two or more cells are considered together. Thus if each cell in a pair stores one of six possible levels, then each cell has a capacity of 2.5 bits. The test chip should facilitate the experimental characterization of the proposed MLDRAM scheme
Keywords :
DRAM chips; integrated circuit design; integrated circuit testing; IC production; MLDRAM; adjustable cell capacity; cell signal levels; circuit parameters; closely spaced signal levels; fractional bits; integrated circuit production; multilevel DRAM design; on-chip noise; per-cell storage capacity; reliable operation; test chip; Circuit testing; Conferences; Integrated circuit noise; Integrated circuit reliability; Noise level; Noise robustness; Production; Random access memory; Signal design; USA Councils;
Conference_Titel :
Electrical and Computer Engineering, 2001. Canadian Conference on
Conference_Location :
Toronto, Ont.
Print_ISBN :
0-7803-6715-4
DOI :
10.1109/CCECE.2001.933699