DocumentCode
3241209
Title
Boiling heat transfer enhancement by submerged vibration induced jets
Author
Tillery, S.W. ; Heffington, S. ; Smith, M.K. ; Glezer, A.
Author_Institution
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
2
fYear
2004
fDate
1-4 June 2004
Firstpage
17
Abstract
This paper describes a new two-phase cooling cell based on channel boiling and a vibration-induced cavitation jet whose collective purpose is to delay the onset of critical heat flux by forcibly dislodging the small vapor bubbles attached to a solid surface during nucleate boiling and propelling them into the cooler bulk liquid within the cell. The submerged turbulent cavitation jet is generated by a vibrating piezoelectric diaphragm operating at resonance. The piezoelectric driver induces pressure oscillations in the liquid near the surface of the driver, resulting in the time-periodic formation and collapse of cavitation bubbles that entrain surrounding liquid and generate a strong liquid jet. The resultant jet, which is directed at a heated surface, enhances boiling heat transfer by removing attached vapor bubbles that insulate the surface while providing additional forced fluid convection on the surface. By introducing a crossflow within the cell, the heat transfer is increased even further due to the fact that the flow sweeps the bubbles downstream while keeping the temperature of the water within the cell regulated.
Keywords
boiling; bubbles; cavitation; channel flow; cooling; electronics packaging; flow visualisation; fluid oscillations; forced convection; jets; nucleation; turbulence; two-phase flow; water; H2O; boiling heat transfer enhancement; channel boiling; cooler liquid; forced fluid convection; forcible dislodging; heat flux; liquid jet; nucleate boiling; piezoelectric diaphragm; piezoelectric driver; pressure oscillations; submerged turbulent cavitation jet; submerged vibration induced cavitation jets; time periodic formation; two-phase cooling cell; vapor bubbles; water; Delay; Heat transfer; Immersion cooling; Insulation; Microelectronics; Packaging; Temperature; Thermal conductivity; Vibrations; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN
0-7803-8357-5
Type
conf
DOI
10.1109/ITHERM.2004.1318247
Filename
1318247
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